In situ Measurement of the Adhesion Strength and Effective Elastic Stiffness of Single Soft Micropillar

We report the deformation behavior and mechanical properties of a polymeric micropillar, which measures approximately 10 μm by 30 μm in size by measuring the loading/unloading response using an in situ force measurement system. When the single poly(dimethylsiloxane) (PDMS) micropillar was subjected to compression, we observed a periodic wrinkle and global (Euler) buckling at the sidewall. During unloading, we found the pull-off force (adhesion force) to increase for higher values of preloading and also for lower loading/unloading rates. From the slope of the load–displacement curves measured in situ, we calculated the effective elastic stiffness of the PDMS micropillar to be about 2.03 MPa. In addition to the current work, we report that this method can be used more broadly for in situ measurement of the intrinsic mechanical and adhesion properties of polymers and other relatively soft materials.     

Pressure drop and optimization meta-models for arbitrary low-height pleated filter shapes and flowrates

Journal of Mechanical Science and Technology - This study delivers equations useful for low-height pleated fibrous filter design: two pressure drop equations and one set of optimum design equations...     

A Self-Healing Nanofiber-Based Self-Responsive Time-Temperature Indicator for Securing a Cold-Supply Chain

Perishable foods at undesired temperatures can generate foodborne illnesses that present significant societal costs. To certify refrigeration succession in a food-supply chain, a flexible, easy-to-interpret, damage-tolerant, and sensitive time-temperature indicator (TTI) that uses a self-healing nanofiber mat is devised. This mat is opaque when refrigerated due to nanofiber-induced light scattering, but becomes irreversibly transparent at room temperature through self-healing-induced interfibrillar fusion leading to the appearance of a warning sign. The mat monitors both freezer (−20 °C) and chiller (2 °C) successions and its timer is tunable over the 0.5–22.5 h range through control of the polymer composition and film thickness. The thin mat itself serves as both a temperature sensor and display; it does not require modularization, accurately measures localized or gradient heat, and functions even after crushing, cutting, and when weight-loaded in a manner that existing TTIs cannot. It also contains no drainable chemicals and is attachable to various shapes because it operates through an intrinsic physical response.     

Gui-A-Gra Attenuates Testicular Dysfunction in Varicocele-Induced Rats via Oxidative Stress,ER Stress and Mitochondrial Apoptosis Pathway

Gui-A-Gra, a commercial insect powder from Gryllus bimaculatus, is registered as an edible insect by the Korean food and drug administration. The aim of this study was to investigate the effect of Gui-A-Gra on testicular damage induced by experimental left varicocele in male Sprague Dawley rats. A total of 72 rats were randomly divided into the following six groups (12 rats in each group): a normal control group (CTR), a group administrated with Gui-A-Gra 1.63 gm/kg (G1.63), a group administrated with Gui-A-Gra 6.5 gm/kg (G6.5), a varicocele (VC)-induced control group (VC), a VC-induced group administrated with Gui-A-Gra 1.63 gm/kg (VC + G1.63), and a VC-induced group administrated with Gui-A-Gra 6.5 gm/kg (VC + G6.5). Rats were administrated 1.63 or 6.5 gm/kg Gui-A-Gra once daily for 42 days. Indicators of sperm parameters, histopathology, reproductive hormones, oxidative stress, endoplasmic reticulum (ER) stress, inflammation, and mitochondrial apoptosis were analyzed to evaluate effects of Gui-A-Gra on VC-induced testicular dysfunction. Gui-A-Gra administration to VC-induced rats significantly (p < 0.05) increased sperm count and sperm motility, Johnsen score, spermatogenic cell density, serum testosterone, testicular superoxide dismutase (SOD), glutathione peroxidase (GPx), catalase, GPx4, and steroidogenic acute regulatory protein (StAR) level. Moreover, pretreatment with Gui-A-Gra significantly (p < 0.05) decreased terminal deoxynucleotidyl transferase-mediated dUTP nick-end labeling (TUNEL) positive cells/tubules, serum luteinizing hormone (LH), serum follicle-stimulating hormone (FSH), testicular tumor necrosis factor-α (TNF-α), interleukin-6 (IL-6), malondialdehyde (MDA), reactive oxygen species (ROS)/reactive nitrogen species (RNS) level, glucose-regulated protein-78 (Grp-78), phosphorylated c-Jun-N-terminal kinase (p-JNK), phosphorylated inositol-requiring transmembrane kinase/endoribonuclease 1α (p-IRE1α), cleaved caspase-3, and BCL2 associated X protein: B-cell lymphoma 2 (Bax: Bcl2) ratio in VC rats. These results suggest that protective effects of Gui-A-Gra on VC-induced testicular injury might be due to its antioxidant, anti-inflammatory, and androgenic activities that might be mediated via crosstalk of oxidative stress, ER stress, and mitochondrial apoptosis pathway.     

Recent Progress of Fiber Shaped Lighting Devices for Smart Display Applications—A Fibertronic Perspective

Advances in material science and nanotechnology have fostered the miniaturization of devices. Over the past two decades, the form-factor of these devices has evolved from 3D rigid, volumetric devices through 2D film-based flexible electronics, finally to 1D fiber electronics (fibertronics). In this regard, fibertronic strategies toward wearable applications (e.g., electronic textiles (e-textiles)) have attracted considerable attention thanks to their capability to impart various functions into textiles with retaining textiles' intrinsic properties as well as imperceptible irritation by foreign matters. In recent years, extensive research has been carried out to develop various functional devices in the fiber form. Among various features, lighting and display features are the highly desirable functions in wearable electronics. This article discusses the recent progress of materials, architectural designs, and new fabrication technologies of fiber-shaped lighting devices and the current challenges corresponding to each device's operating mechanism. Moreover, opportunities and applications that the revolutionary convergence between the state-of-the-art fibertronic technology and age-long textile industry will bring in the future are also discussed.     

The latent learning model to derive semantic relations of words from unstructured text data in social media

Multimedia Tools and Applications - Unstructured text data is very important in many applications because it reflects the thought of the people who create this data. However, it is difficult to...     

A Modular Solder System with Hierarchical Morphology and Backward Compatibility

A modular solder system with hierarchical morphology and micro/nanofeatures in which solder nanoparticles are distributed on the surface of template micropowders is reported. A core–shell structure of subsidiary nanostructures, which improved the intended properties of the modular solder is also presented. In addition, polymer additives can be used not only as an adhesive (like epoxy resin) but also to impart other functions. By combining all of these, it is determined that the modular solder system is able to increase reflowability on a heat‐sensitive plastic substrate, oxidation resistance, and electrical conductivity. In this respect, the system could be readily modified by changing the structure and composition of each constituent and adopting backward compatibility with which the knowledge and information attained from a previously designed solder can offer feedback toward further improving the properties of a newly designed one. In practice, In–Sn–Bi nanoparticles engineered on the surface of Sn–Zn micropowders result in pronounced reflowing on a flexible Au‐coated polyethylene terephthalate (PET) substrate even at the low temperature of 110 °C. Depending on their respective concentrations, the incorporation of CuO@CeO₂ nanostructures and poly(3,4‐ethylenedioxythiophene) polystyrene sulfonate (PEDOT:PSS) polymers increases oxidation resistance and electrical conductivity of the modular solder.